Method Statement/Procedure: Hard Copper Pipe & Potable Water Line

This Method Statement describes solders and fluxes melting below 427°C (800°F), joint design, application temperature, testing, and soldering equipment. Hard solders (high temperature silver solders) which melt at approximately 1100°F are beyond the scope of this Method Statement.

PRE-INSTALLATION ACTIVITIES:

• Ensure that all relevant documents have been approved by OWNER prior to installation, and that the latest revisions of IFC drawings, specifications including, approved procedures are disseminated to concerned personnel who will carry out the work.

• Ensure that all-Hard Copper Pipe Plumbing Material to be transported from warehouse / laydown areas to the work area comply with the project specifications. Site handling and identification of all piping materials and components shall be in accordance with SUBCON Standard Operating Instructions. 

• Check and verify the location and orientation of piping to plant North on IFC isometrics / plan drawings. Establish good reference points for proper alignment.

JOINT DESIGN:

• For maximum strength, a clearance of 0.075 mm (0.0031 in) between mating parts is recommended. This provides clearance for capillary action necessary to pull the soft solder into the joint and to keep oxides from reforming.

• Except for potable (drinking) water systems, tin-lead solder (50/50) can be used for the majority of applications.

• Lead-free with weight composition of 95.5% tin, 4.0% copper and 0.5% silver shall be use for jointing potable water copper pipe.

JOINTING METHOD

• Pipe ends shall be cut square using a pipe cutter or hacksaw. All burrs shall be removed with a reamer or round file.

• Ensure the end of the pipe to be soldered and the socket are thoroughly cleaned to bright metal by use of wire wool or sand paper.

• Apply liberal amounts of flux to both the pipe end(s) and the socket(s) ensuring all the surfaces to be soldered are covered.

• Insert the pipe end(s) into the socket ensuring full penetration.

• Excessive heat will cause problems with quality of the joint (flux carbonises and solder will not adhere to the copper), therefore size of heating torch chosen and control of the heat are important.

• Apply heat evenly all around the joint to both the socket and the pipe until the correct heat temperature is reached (approximately 380ºC) This is evident when the solder turns to liquid and becomes free flowing.

• Apply the solder at a position where the outside of the pipe meets the top edge of the socket. As soon as the solder starts to melt and flow freely remove the heat source and continue to apply the solder at the same position (do not move around the joint with the solder)

• The solder will flow into and around the joint by capillary action, as soon as a fine silver bead is evident all around the top of the socket stop applying the solder. Clean off any excess solder and flux with wire wool. Keep the pipe and joint firm until the joint has cooled down sufficiently. Under no circumstances shall the joint be cooled by quenching with water.

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